Motion SPM? Intelligent power module：

　　Fairchild offers a set of highly integrated intelligent power Modular, provide efficient motor control for a wide range of energy regulation type application. SPM series solution can improve efficiency and simplify the design of the system, saves space on the circuit board, improves the reliability of the system and accelerate time to market.

Why choose our SPM ? products

Motion SPM? Smart Power ModulesIn an efficient, reliable package integrated discrete devices. Our SPM ? packaging and process technology is the key to control the application of the large power motor differential.

• The most widely used packaging motor control applications (below 10 HP)
• After optimization of the package, power density can provide high thermal performance, good and strong assembly
• Small size, suitable for middle / low power industrial applications
• Junction temperature range is wide and the assurance: -40 ° C to +150 ° C
• Package has a larger creepage distance / clearance, suitable for high voltage applications
• More excellent durability, by optimizing the conduction and switching losses
• Beyond the appliance of low cost and high efficiency requirements
• The production of high reliability can improve customer production

Select motor control application solutions for your

Motion SPM? Product mix

SPM 2 Series

The application of power up to 75A/600V. Low side induction IGBT for overcurrent protection, thermistor built for monitoring temperature. 15A 30A Modular ceramic substrate package. 50A and 75A Modular using copper coated ceramic substrate (DCB) package, in order to reduce the thermal impedance. The input gate signal with low activity。

• FSAMxxSM: SM Represents the middle frequency switching and low conduction loss.
• FSAMxx SH: SH said the high switching frequency and low conduction loss.

SPM 3 Series

For a Series from 3A to 30A/600V wide power supply application. The input gate signal is high effective.

SPM 3 V2 SeriesRequirements are external pin is connected to the output between the Vs and U/V/W.

• FSBSxxCHxx: S Said ceramic substrate for packaging 3A, 5A, 10A, 15A and 25A Modular.
• FSBBxxCHxx: B Representation for copper coated ceramic substrate 15A, 20A and 30A Modular (DCB) package.

SMP 3 V4 Series Vs, has a built-in boost diode and over temperature protection internal connection.

• FSBSxxCHxxB： F And B said the package substrate for 3A, 5A, 10A and 15 A respectively.
• FSBBxxCHxxC： B And C said copper coated ceramic substrate for 15 A, 20 A and 30 A Modular (DCB) package.

SPM 45 Series

In less than 20 A, the ceramic substrate package, cost sensitive applications to achieve temperature control built-in boost diode and thermistor. The input gate signal is high effective. SPM 45 Series into two categories:

• Conduction loss of FNA/FNC is lower, is recommended for the application of the switch frequency of about 15 kHz.
• FNB The switching loss is lower, is recommended for the application of switching frequency of about 15 kHz.

SPM 5 Series

To compact the highest 200 W low power motor control applications, such as refrigerators, air blower and water pump etc.. SPM 5 Series including six SuperFET ? FRFET ? MOSFET or FRFET ? MOSFET and IC half bridge gate driver. With 600 V, 500 V, 250 V and 60 V Modular. The input gate signal is high effective.

SPM 5 V1 SeriesIncludes six FRFET? MOSFET（500 V、250 V、60 V) and external respectively by pin connections between Vs and U/V/W output. FSB5xx50T Except.

• FSB5XX50： The conventional DIP lead forming (blank), special Vs pin
• FSB5XX50S： SMD lead forming (S), a special Vs pin
• FSB5XX06S： SMD lead forming (S), 60 V FRFET ? MOSFET, special Vs pin
• FSB5XX50T： Double DIP lead forming (T), no special Vs pin
• FSB5XX25T： Double DIP lead forming (T), 250 V FRFET ? MOSFET, no special Vs pin

SPM 5 V 1.5 SeriesIncludes six FRFET ? MOSFET (500 V, 250 V) and external respectively by pin connections between Vs and U/V/W output. Except for FSB5XX50UTD

• FSB5XX50UD： The conventional DIP lead forming (U), built-in boost diode (D), a special Vs pin
• FSB5XX50US： SMD lead forming (US), without the boost diode, a dedicated Vs pin
• FSB5XX25US: SMD lead forming (US), 250 V FRFET ? MOSFET, without the boost diode, a dedicated Vs pin
• FSB5XX50UTD： Double DIP lead forming (UT), built-in boost diode (D), no special Vs pin

SPM 5 V2 SeriesContains six FRFET ? MOSFET (500V), with built-in boost diode, the heat sensing function (Vts) and Vs connection.

• FSB5XX50A： The conventional DIP lead forming (A), no special Vs pin
• FSB5XX50AS： SMD lead forming (AS), no special Vs pin
• FSB5XX25A： SMD lead forming (US), 250 V FRFET ? MOSFET, no special Vs pin
• FSB5XX50AT： Double DIP lead forming (AT), no special Vs pin

SPM 5 SuperFET SeriesIncludes six SuperFET ? FRFET ? MOSFET (600V), with built-in boost diode, the heat sensing function (Vts) and Vs connection。

• FSB5XX60SF： The conventional DIP lead forming (SF), no special Vs pin
• FSB5XX60SFT： Double DIP lead forming (SFT), no special Vs pin

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